CC2591

Table 1. TERMINAL FUNCTIONS

TERMINAL

TYPE

DESCRIPTION

NO.

NAME

The exposed die attach pad must be connected to a solid ground plane. See

—

GND

Ground

CC2591EM reference design for recommended layout.

1

2.0 V – 3.6 V Power. PCB trace to this pin serves as inductive load to PA . See

AVDD_PA1

Power

CC2591EM reference design for recommended layout.

2

RF_N

RF

RF interface towards CC24xx or CC25xx device.

RXTX switching voltage when connected to CC24xx devices. See Table 3 and Table 4

3

RXTX

Analog/Control

for details.

4

RF_P

RF

RF interface towards CC24xx or CC25xx device

5

PAEN

Digital Input

Digital control pin. See Table 3 and Table 4 for details.

6

EN

Digital Input

Digital control pin. See Table 3 and Table 4 for details.

Digital control pin.

7

HGM

Digital Input

HGM=1

→ Device in High Gain Mode

HGM=0

→ Device in Low Gain Mode (RX only)

Secondary ground connections. Should be shorted to the die attach pad on the top

8, 9, 12, 14

GND

Ground

PCB layer.

2.0 V – 3.6 V Power. PCB trace to this pin serves as inductive load to PA. See

10

AVDD_PA2

Power

CC2591EM reference design for recommended layout.

11

ANT

RF

Antenna interface.

2 V – 3.6 V Power. PCB trace to this pin serves as inductive load to LNA. See

13

AVDD_LNA

Power

CC2591EM reference design for recommended layout.

15

BIAS

Analog

Biasing input. Resistor between this node and ground sets bias current to PAs.

16

AVDD_BIAS

Power

2 V – 3.6 V Power.

Copyright © 2008, Texas Instruments Incorporated

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Product Folder Link(s): CC2591