TX+

TX-

GND

RX+

RX-

VBUS

D-

D+

GND

TX+

TX-

GND

RX+

RX-

VBUS

D-

D+

GND

8-mm

1-mm

GND

D+

D-

1-mm

1-mm

GND

D+

D-

TPD2EUSB30

USB 3.0

Host/ Controller/ PHY

Pattern Generator

USB3.0 Receiver PHY

36” Lossy Transmission Line

Eye Pattern

Measurement Point

TPD2EUSB30

SLVSA12 – NOVEMBER 2009

www.ti.com

APPLICATION INFORMATION

Layout Guide with TPD2EUSB30DRTR

Refer to Figure 7, the TPD2EUSB30DRTR is offered in space saving DRT package. The DRT package is a

1mm* 1mm package with flow-through pin-mapping for the high-speed differential lines. It is recommended to

place the DRT package right next to the USB 3.0 connector. The GND pin should connected to GND plane of the

board through a large VIA. If a dedicated GND plane is not present right underneath, it is recommended to route

to the GND plane through a wide trace. The current associated with IEC ESD stress can be in the range of

30Amps or higher momentarily. A good, low impedance GND path ensures the system robustness against IEC

ESD stress.

The TPD2EUSB30 can provide system level ESD protection to the high-speed differential ports (>6 Gbps data

rate). The flow-through package offers flexibility for board routing with traces up to 15 mills wide. It allows the

differential signal pairs couple together right after they touch the ESD ports (pin 1 and pin 2) of the

TPD2EUSB30.

Figure 7. Layout Guide with the TPD2EUSB30 at the USB3.0 Class A connector

TPD2EUSB30 Eye Pattern Test Setup

See Figure 9 for a demonstration of the TPD2EUSB30 performance the lab set-up. Figure 8 shows a lab board

that was designed to demonstrate the degradation of the eye pattern quality with and without the TPD2EUSB30

in the USB 3.0 signal path. Figure 10 shows that there is only ~2 ps jitter penalty to the differential signal when

the TPD2EUSB30 device was added in the signal path

Figure 8. Measurement Setup to collect the Eye Pattern on a Reference Board with TPD2EUSB30

4

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Product Folder Link(s): TPD2EUSB30