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MCP1826ST-5002E/EB 数据表(PDF) 21 Page - Microchip Technology |
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MCP1826ST-5002E/EB 数据表(HTML) 21 Page - Microchip Technology |
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21 / 36 page ![]() © 2007 Microchip Technology Inc. DS22057A-page 21 MCP1826/MCP1826S 5.3.1.2 Junction Temperature Estimate To estimate the internal junction temperature, the calculated temperature rise is added to the ambient or offset temperature. For this example, the worst-case junction temperature is estimated below: 5.3.1.3 Maximum Package Power Dissipation at 60°C Ambient Temperature From this table, you can see the difference in maximum allowable power dissipation between the TO-220-5 package and the DDPAK-5 package. TJ =TJRISE + TA(MAX) TJ = 30.12°C + 60.0°C TJ = 90.12°C TO-220-5 (29.3° C/W R θJA): PD(MAX) = (125°C – 60°C) / 29.3°C/W PD(MAX) = 2.218W DDPAK-5 (31.2°C/Watt R θJA): PD(MAX) = (125°C – 60°C)/ 31.2°C/W PD(MAX) = 2.083W |
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