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PIC16F505-E/MS 数据表(PDF) 91 Page - Microchip Technology |
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PIC16F505-E/MS 数据表(HTML) 91 Page - Microchip Technology |
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91 / 110 page ![]() © 2009 Microchip Technology Inc. DS41236E-page 91 PIC12F508/509/16F505 12.0 PACKAGING INFORMATION 12.1 Package Marking Information 8-Lead SOIC (3.90 mm) XXXXXXXX XXXXYYWW NNN Example 12F509-I /SN 0610 017 8-Lead MSOP XXXXXX YWWNNN Example 12F509 0610017 3 e X X X Y W W N N 8-Lead 2x3 DFN* B E Q 6 1 0 1 7 Example XXXXXNNN 8-Lead PDIP XXXXXXXX YYWW /P 017 Example 12F508-I 0610 3 e Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard PIC® device marking consists of Microchip part number, year code, week code, and traceability code. For PIC device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. 3 e 3 e |
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