LT3579/LT3579-1

39

35791f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTION

4.00 ± 0.10

(2 SIDES)

1.50 REF

5.00 ± 0.10

(2 SIDES)

NOTE:

1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1

TOP MARK

(NOTE 6)

0.40 ± 0.10

19

20

1

2

BOTTOM VIEW—EXPOSED PAD

2.50 REF

0.75 ± 0.05

R = 0.115

TYP

PIN 1 NOTCH

R = 0.20 OR

C = 0.35

0.25 ± 0.05

0.50 BSC

0.200 REF

0.00 – 0.05

(UFD20) QFN 0506 REV B

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.70 ±0.05

0.25 ±0.05

2.65 ± 0.05

2.50 REF

4.10 ± 0.05

5.50 ± 0.05

1.50 REF

3.10 ± 0.05

4.50 ± 0.05

PACKAGE OUTLINE

R = 0.05 TYP

2.65 ± 0.10

3.65 ± 0.10

3.65 ± 0.05

0.50 BSC

UFD Package

20-Lead Plastic QFN (4mm × 5mm)

(Reference LTC DWG # 05-08-1711 Rev B)