ADM1032

http://onsemi.com

2

Figure 1. Functional Block Diagram

ON−CHIP

TEMPERATURE

SENSOR

A/D

CONVERTER

BUSY

RUN/STANDBY

EXTERNAL DIODE OPEN−CIRCUIT

ADDRESS POINTER

REGISTER

CONVERSION RATE

REGISTER

REMOTE TEMPERATURE

HIGH LIMIT REGISTER

CONFIGURATION

REGISTER

INTERRUPT

MASKING

LIMIT

COMPARATOR

REMOTE TEMPERATURE

VALUE REGISTER

LOCAL TEMPERATURE

VALUE REGISTER

GND

SDATA

SCLK

ALERT

D+

D–

REMOTE TEMPERATURE

LOW LIMIT REGISTER

LOCAL TEMPERATURE

HIGH LIMIT REGISTER

LOCAL TEMPERATURE

LOW LIMIT REGISTER

ANALOG

MUX

ADM1032

EXTERNAL THERM LIMIT

REGISTER

STATUS REGISTER

SMBUS INTERFACE

REMOTE OFFSET

REGISTER

THERM

LOCAL THERM LIMIT

REGISTER

ABSOLUTE MAXIMUM RATINGS

Parameter

Rating

Unit

−0.3, +5.5

V

D+

V

D− to GND

−0.3 to +0.6

V

SCLK, SDATA, ALERT

−0.3 to +5.5

V

THERM

V

Input Current, SDATA, THERM

−1, +50

mA

Input Current, D−

±1

mA

ESD Rating, All Pins (Human Body Model)

>1000

V

150

°C

Storage Temperature Range

−65 to +150

°C

IR Reflow Peak Temperature

220

°C

IR Reflow Peak Temperature for Pb−Free

260

°C

Lead Temperature (Soldering 10 sec)

300

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.

THERMAL CHARACTERISTICS

Package Type

Unit

8−Lead SOIC−N Package

121

°C

8−Lead MSOP Package

142

°C