108-98001 Rev. M

All specifications subject to change. Consult Tyco Electronics for latest specifications.

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AXICOM Signal Relays

IM Relay

Soldering conditions according IEC 60058-2-58 and

IPC/JEDEC J-STD-020B

Infrared Soldering: Temperature/Time Profile

(Lead and Housing Peak Temperature)

240 °C

180 °C

130 °C

100 °C

20 - 40 sec

Full line:

typical

Dotted line: process limits

forced

cooling

Time (s)

Time (s)

Infrared Soldering: Temperature/Time Profile

(Lead and Housing Peak Temperature)

Time (s)

Recommended Soldering Conditions

Recommended Reflow Soldering Profile

Resistance to Soldering Heat - Reflow Profile

Vapor Phase Soldering: Temperature/Time Profile

(Lead and Housing Peak Temperature)