M24C02-RBN3TPSLASHS datasheet(26/39 Pages) STMICROELECTRONICS

26 / 39 page

Package mechanical data

M24C16, M24C08, M24C04, M24C02, M24C01

26/39

Doc ID 5067 Rev 16

Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Figure 13.

WLCSP (0.5 mm) and Thin WLCSP (0.3 mm) 0.4 mm pitch 5 bumps,

package outline

Drawing is not to scale.

Table 17.

M24C08: WLCSP (0.5 mm height) 0.4 mm pitch, 5 bumps, package data

Symbol

millimeters

inches(1)

Values in inches are converted from mm and rounded to 4 decimal digits.

Typ

Min

Max

Typ

Min

Max

0.545

0.495

0.595

0.0215

0.0195

0.0234

0.19

0.165

0.215

0.0075

0.0065

0.0085

0.355

0.33

0.38

0.014

0.013

0.015

0.27

0.24

0.3

0.0106

0.0094

0.0118

1.215

1.195

1.235

0.0478

0.047

0.0486

1.025

1.005

1.045

0.0404

0.0396

0.0411

0.4

0.0157

0.693

0.0273

0.346

0.0136

0.313

0.0123

0.261

0.0103

N(2)

N is the total number of terminals.

Orientation reference

SEATING PLANE

1Ca_ME

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