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LMV331 数据表(PDF) 3 Page - ON Semiconductor

部件名 LMV331
功能描述  Single, Dual, Quad General Purpose, Low Voltage Comparators
PDF  21 Pages
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制造商  ONSEMI [ON Semiconductor]
网页  http://www.onsemi.com
标志 ONSEMI - ON Semiconductor

LMV331 数据表(HTML) 3 Page - ON Semiconductor

  LMV331 Datasheet HTML 1Page - ON Semiconductor LMV331 Datasheet HTML 2Page - ON Semiconductor LMV331 Datasheet HTML 3Page - ON Semiconductor LMV331 Datasheet HTML 4Page - ON Semiconductor LMV331 Datasheet HTML 5Page - ON Semiconductor LMV331 Datasheet HTML 6Page - ON Semiconductor LMV331 Datasheet HTML 7Page - ON Semiconductor LMV331 Datasheet HTML 8Page - ON Semiconductor LMV331 Datasheet HTML 9Page - ON Semiconductor Next Button
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LMV331, LMV393, LMV339
http://onsemi.com
3
MAXIMUM RATINGS
Symbol
Rating
Value
Unit
VS
Voltage on any Pin (referred to Vpin)
5.5
V
VIDR
Input Differential Voltage Range
±Supply Voltage
V
TJ
Maximum Junction Temperature
150
°C
Tstg
Storage Temperature Range
−65 to 150
°C
TL
Mounting Temperature (Infrared or Convection (1/16″ From Case for 30 Seconds))
260
°C
VESD
ESD Tolerance (Note 1)
Machine Model
Human Body Model
100
1000
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Value
Unit
VCC
Supply Voltage Temperature Range (Note 2)
2.7 to 5.0
V
qJA
Thermal Resistance
SC−70
TSOP−5
ULLGA8
Micro8
SOIC−8
UDFN8
SOIC−14
TSSOP−14
280
333
340
238
212
350
156
190
°C/W
1. Human Body Model, applicable std. MIL−STD−883, Method 3015.7. Machine Model, applicable std. JESD22−A115−A (ESD MM std. of
JEDEC) Field−Induced Charge−Device Model, applicable std. JESD22−C101−C (ESD FICDM std. of JEDEC).
2. The maximum power dissipation is a function of TJ(MAX), qJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) − TA)/qJA. All numbers apply for packages soldered directly onto a PC board.



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