THS7360

SLOS674 – JUNE 2010

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PRODUCT

PACKAGE-LEAD

TRANSPORT MEDIA, QUANTITY

THS7360IPW

Rails, 70

TSSOP-20

Pb-Free, Green

THS7360IPWR

Tape and Reel, 2000

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder at ti.com.

(2)

These packages conform to Lead (Pb)-free and green manufacturing specifications. Additional details including specific material content

can be accessed at www.ti.com/leadfree.

GREEN: TI defines Green to mean Lead (Pb)-Free and in addition, uses less package materials that do not contain halogens, including

bromine (Br), or antimony (Sb) above 0.1% of total product weight. N/A: Not yet available Lead (Pb)-Free; for estimated conversion

dates, go to www.ti.com/leadfree. Pb-FREE: TI defines Lead (Pb)-Free to mean RoHS compatible, including a lead concentration that

does not exceed 0.1% of total product weight, and, if designed to be soldered, suitable for use in specified lead-free soldering

processes.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

THS7360

UNIT

5.5

V

V

±90

mA

Continuous power dissipation

See the Thermal Information Table

+150

°C

+125

°C

–60 to +150

°C

Human body model (HBM)

4000

V

ESD rating:

Charge device model (CDM)

1000

V

Machine model (MM)

200

V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2)

The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.

(3)

The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this

temperature may result in reduced reliability and/or lifetime of the device.

THERMAL INFORMATION

THS7360

PW

UNITS

20 PINS

Junction-to-ambient thermal resistance

108.0

Junction-to-case(top) thermal resistance

41.6

Junction-to-board thermal resistance

61.3

°C/W

Junction-to-top characterization parameter

2.9

Junction-to-board characterization parameter

58.4

Junction-to-case(bottom) thermal resistance

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

Submit Documentation Feedback

Copyright © 2010, Texas Instruments Incorporated

Product Folder Link(s): THS7360