ABSOLUTE MAXIMUM RATINGS

(1)

PIN CONFIGURATIONS

V

IN-

V

IN+

V-

R

G

V+

V

OUT

1

2

3

4

8

7

6

5

INA333

R

G

REF

R

G

V

IN-

V

IN+

V-

R

G

V+

V

OUT

REF

1

2

3

4

8

7

6

5

Exposed

Thermal

DiePad

on

Underside

INA333

INA333

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PRODUCT

PACKAGE-LEAD

PACKAGE DESIGNATOR

PACKAGE MARKING

MSOP-8

DGK

I333

INA333

DFN-8

DRG

I333A

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

INA333

UNIT

Supply voltage

+7

V

(V–) – 0.3 to (V+) + 0.3

V

Continuous

–40 to +150

°C

–65 to +150

°C

+150

°C

Human body model (HBM)

4000

V

ESD rating

Charged device model (CDM)

1000

V

Machine model (MM)

200

V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2)

Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails should

be current limited to 10mA or less.

(3)

Short-circuit to ground.

DGK PACKAGE

DRG PACKAGE

MSOP-8

DFN-8

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2

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