DESCRIPTION/ORDERING INFORMATION

SN74LVC1G07

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

The output of the SN74LVC1G07 device is open drain and can be connected to other open-drain outputs to

implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION

ORDERABLE

TOP-SIDE

PART NUMBER

NanoFree™ – WCSP (DSBGA)

Reel of 3000

SN74LVC1G07YZPR

_ _ _CV_

0.23-mm Large Bump – YZP (Pb-free)

NanoFree™ – WCSP (DSBGA)

_ _ _ _

Reel of 3000

SN74LVC1G07YZVR

0.23-mm Large Bump – YZV (Pb-free)

CV

SN74LVC1G07DRYR

SON – DRY

Reel of 5000

CV_

–40

＝C to

SN74LVC1G07DRYRG4

85

＝C

Reel of 3000

SN74LVC1G07DBVR

SOT (SOT-23) – DBV

C07_

Reel of 250

SN74LVC1G07DBVT

Reel of 3000

SN74LVC1G07DCKR

SOT (SC-70) – DCK

CV_

Reel of 250

SN74LVC1G07DCKT

SOT (SOT-553) – DRL

Reel of 4000

SN74LVC1G07DRLR

CV_

(1)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(2)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(3)

DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

YZV: The actual top-side marking is on two lines. Line 1 has four characters to denote year, month, day, and assembly/test site. Line 2

has two characters which show the family and function code. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

2

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Product Folder Link(s): SN74LVC1G07