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PACUSB-U2 数据表(PDF) 4 Page - ON Semiconductor |
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PACUSB-U2 数据表(HTML) 4 Page - ON Semiconductor |
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4 / 9 page ![]() PACUSB-U1/U2/U3 Rev.2 | Page 4 of 9 | www.onsemi.com ELECTRICAL OPERATING CHARACTERISTICS SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS R1 Resistance R1 (PACUSB-U1 only) Measured at T A = 25°C 12 15 18 Ω R1 Resistance R1 (PACUSB-U2 only) Measured at T A = 25°C 26 33 40 Ω R1 Resistance R1 (PACUSB-U3 only) Measured at T A = 25°C 18 22 26 Ω R2 Resistance R2 Measured at T A = 25°C 1.2 1.5 1.8 k Ω C1 Capacitance C1 Measured at 1 MHz, 2.5VDC, T A =25°C 38 47 56 pF I LEAK Diode Leakage Current to GND At 3.3VDC and T A = 25°C 1 100 nA V D1 Diode Reverse-biased Stand-off Voltage I = 10 μA,T A = 25°C 5.5 V V D2 Signal Clamp Voltage Positive Clamp Negative Clamp @ 10mA, T A = 25°C @ 10mA, T A = 25°C 5.6 -1.2 6.8 -0.8 8.0 -0.4 V V V ESD In-system ESD Withstand Voltage Human Body Model, MIL-STD- 883, Method 3015 IEC 61000-4-2, contact discharge method (I/O pins) IEC 61000-4-2, contact discharge method (V 3.3 pin) Note 1 Note 1 Note 1 ±30 ±15 ±25 kV kV kV V CLAMP Clamping Voltage during ESD Discharge Positive Negative MIL-STD-883, Method 3015, 8kV; Note 1 10 -5 V V Note 1: ESD applied to input/output/V 3.3 pins with respect to GND, one at a time. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin (i.e., if ESD is applied to pin 1, then clamping voltage is measured at pin 6). Unused pins are open. |
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