数据搜索系统,热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

RF2153PCBA 数据表(PDF) 4 Page - RF Micro Devices

部件名 RF2153PCBA
功能描述  CDMA/TDMA/PACS 1900MHZ 3V POWER AMPLIFIER
PDF  12 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  RFMD [RF Micro Devices]
网页  http://www.rfmd.com
标志 RFMD - RF Micro Devices

RF2153PCBA 数据表(HTML) 4 Page - RF Micro Devices

  RF2153PCBA Datasheet HTML 1Page - RF Micro Devices RF2153PCBA Datasheet HTML 2Page - RF Micro Devices RF2153PCBA Datasheet HTML 3Page - RF Micro Devices RF2153PCBA Datasheet HTML 4Page - RF Micro Devices RF2153PCBA Datasheet HTML 5Page - RF Micro Devices RF2153PCBA Datasheet HTML 6Page - RF Micro Devices RF2153PCBA Datasheet HTML 7Page - RF Micro Devices RF2153PCBA Datasheet HTML 8Page - RF Micro Devices RF2153PCBA Datasheet HTML 9Page - RF Micro Devices Next Button
Zoom Inzoom in Zoom Outzoom out
 4 / 12 page
background image
2-170
RF2153
Rev A18 001114
2
Pin
Function
Description
Interface Schematic
1
VCC2
Power supply for second stage and interstage match. Pins 1, 15 and 16
should be connected by a common trace where the pins contact the
printed circuit board.
2
GND2
Ground for second stage. Keep traces physically short and connect
immediately to ground plane for best performance. This ground should
be isolated from the backside ground contact on top metal layer.
3
VCC1
Power supply for first stage and interstage match. VCC should be fed
through a 1.5nH inductor terminated with a 15pF capacitor on the sup-
ply side.
See pin 4.
4RF IN
RF input. An external 15pF series capacitor is required as a DC block
and also provides for an input VSWR of < 2:1 typical.
5
GND1
Ground for first stage. Keep traces physically short and connect imme-
diately to ground plane for best performance. This ground should be
isolated from the backside ground contact on top metal layer.
See pin 4.
6
VPD1
Power Down control for first and second stages. When this pin is “low”,
all first and second stage circuits are shut off. When this pin is 2.8V, all
first stage circuits are operating normally. VPD1 requires a regulated
2.8V for the amplifier to operate properly over all specified temperature
and voltage ranges. A dropping resistor from a higher regulated voltage
may be used to provide the required 2.8V.
7VMODE
For full power operation, MODE is set low. VMODE will reduce the bias
current by up to 50% when set HIGH. Large Signal Gain is reduced
approximately 1.5dB at 29dBm POUT and Small Signal Gain is reduced
approximately 6dB. An external series resistor is optional to limit the
amount of current required by the VMODE pin.
8
VPD2
Power Down control for the third stage. When this pin is “low”, the third
stage circuit is shut off. When this pin is 2.8V, the third stage circuit is
operating normally. VPD requires a regulated 2.8V for the amplifier to
operate properly over all specified temperature and voltage ranges. A
dropping resistor from a higher regulated voltage may be used to pro-
vide the required 2.8V. A 15pF high frequency bypass capacitor is rec-
ommended.
9
BIAS GND
Requires a 15nH inductor.
10
RF OUT
RF output and power supply for final stage. This is the unmatched col-
lector output of the third stage. A DC block is required following the
matching components. The biasing may be provided via a parallel L-C
set for resonance at the operating frequency of 1850MHz to 1910MHz.
It is important to select an inductor with very low DC resistance with a
1A current rating. Alternatively, shunt microstrip techniques are also
applicable and provide very low DC resistance. Low frequency bypass-
ing is required for stability.
11
RF OUT
Same as pin 12.
See pin 10.
12
RF OUT
Same as pin 12.
See pin 10.
13
2FO
Second harmonic trap. Keep traces physically short and connect imme-
diately to ground plane. This ground should be isolated from backside
ground contact.
14
VCC
Supply for bias reference and control circuits. High frequency bypass-
ing may be necessary.
15
VCC2
Same as pin 1.
16
VCC2
Same as pin 1.
Pkg
Base
GND
Ground connection. The backside of the package should be soldered to
a top side ground pad which is connected to the ground plane with mul-
tiple vias. The pad should have a short thermal path to the ground
plane.
GND1
RF IN
VCC1
From Bias
Network
RF OUT
From Bias
Network



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12


数据表 下载

Go To PDF Page


链接网址



ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   数据表链接    |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com