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RF2163PCBA 数据表(PDF) 3 Page - RF Micro Devices

部件名 RF2163PCBA
功能描述  3V, 2.5GHZ LINEAR POWER AMPLIFIER
PDF  6 Pages
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制造商  RFMD [RF Micro Devices]
网页  http://www.rfmd.com
标志 RFMD - RF Micro Devices

RF2163PCBA 数据表(HTML) 3 Page - RF Micro Devices

  RF2163PCBA Datasheet HTML 1Page - RF Micro Devices RF2163PCBA Datasheet HTML 2Page - RF Micro Devices RF2163PCBA Datasheet HTML 3Page - RF Micro Devices RF2163PCBA Datasheet HTML 4Page - RF Micro Devices RF2163PCBA Datasheet HTML 5Page - RF Micro Devices RF2163PCBA Datasheet HTML 6Page - RF Micro Devices  
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Preliminary
2-251
RF2163
Rev A2 001221
2
Pin
Function
Description
Interface Schematic
1GND
Ground connection. For best performance, keep traces physically short
and connect immediately to ground plane.
2RF IN
RF input. This input is AC coupled, so an external blocking capacitor is
not required if this pin is connected to a DC path.
See pin 14.
3BIAS GND2 Ground for second stage bias circuit. For best performance, keep
traces physically short and connect immediately to ground plane.
4
PWR SEN
The PWR SEN and PWR REF pins can be used in conjunction with an
external feedback path to provide an RF power control function for the
RF2163. The power control function is based on sampling the RF drive
to the final stage of the RF2163.
5PWR REF
Same as pin 4.
6VREG1
This pin requires a regulated supply to maintain the correct bias cur-
rent.
7VREG2
Same as pin 6.
8BIAS GND1 Ground for first stage bias circuit. For best performance connect to
ground with a 10nH inductor.
9GND
Same as pin 1.
10
RF OUT
RF output and bias for the output stage. The power supply for the out-
put transistor needs to be supplied to this pin. This can be done
through a quarter-wave length microstrip line that is RF grounded at the
other end, or through an RF inductor that supports the required DC cur-
rents.
11
RF OUT
Same as pin 10.
See pin 10.
12
RF OUT
Same as pin 10.
See pin 10.
13
NC
Not connected.
14
VCC1
Power supply pin for the bias circuits. External low frequency bypass
capacitors should be connected if no other low frequency decoupling is
nearby.
15
VCC1
Same as pin 14.
See pin 14.
16
VCC
Same as pin 14.
See pin 14.
Pkg
Base
GND
Ground connection. The backside of the package should be connected
to the ground plane through a short path, i.e., vias under the device
may be required.
See pin 1 and 2.
RF OUT
RF IN
BIAS
VCC



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