Preliminary
2-251
RF2189
Rev A4 010424
2
Pin
Function
Description
Interface Schematic
1GND
Ground connection. Keep traces physically short and connect immedi-
ately to ground plane for best performance.
2GND
Same as pin 1.
3GND
Same as pin 1.
4NC
Not connected.
5NC
Not connected.
6RF IN
RF input. This input is DC coupled, so an external blocking capacitor is
required if this pin is connected to a DC path.
See pin 1.
7NC
Not connected.
8PC
Power control pin. For maximum power this pin should be 3.3V. A
higher voltage is not recommended. For less output power and reduced
idle current this voltage may be reduced.
9GND
Ground connection. Keep traces physically short and connect immedi-
ately to ground plane for best performance.
10
NC
Not internally connected.
11
RF OUT
RF output and bias for the output stage. The power supply for the out-
put transistor needs to be supplied to this pin. This can be done
through a quarter-wave length microstrip line that is RF grounded at the
other end, or through an RF inductor that supports the required DC cur-
rents.
12
RF OUT
Same as pin 11.
See pin 11.
13
NC
Not connected.
14
VCC1
Power supply pin for the bias circuits. External low frequency bypass
capacitors should be connected if no other low frequency decoupling is
nearby.
See pin 5.
15
VCC2
Bias supply pin for the first stage. A small tuning capacitor is required to
set the desired frequency response. External low frequency bypass
capacitors should be connected as shown in the application schematic
if no other low frequency decoupling is nearby.
16
VCC2
Connected internally to pin 15.
See pin 15.
Pkg
Base
GND
Ground connection. The backside of the package should be connected
to the ground plane through a short path, i.e., vias under the device
may be required.
Seepin 1and 6.
PC
500
Ω
VCC1
To RF
Stages
RF OUT
RF IN
BIAS
VCC2
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