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SC615AEVB 数据表(PDF) 10 Page - Semtech Corporation |
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SC615AEVB 数据表(HTML) 10 Page - Semtech Corporation |
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10 / 12 page ![]() 10 © 2008 Semtech Corp. www.semtech.com POWER MANAGEMENT SC615A Layout Guidelines The following layout is suggested for a two-layer design. The capacitors C1 and C2 are the bucket capacitors and each conducts the full load current of up to 500mA pulsed for one half clock cycle. C3 is the output decoupling ca- pacitor placed near the SC615A VOUT pin. C4 is the input decoupling capacitor placed near the SC615A VIN pin. Multiple vias should be used whenever it is necessary to change layers on nets connecting to pins VIN, VOUT, GND, C1-, C1+, C2- and C2+. Resistor R1 is routed with a very low resistance connection between R1 and GND pin 3. The sense trace between Pin 6 and R1 is routed around the ground vias, allowing the shortest ground return path Bottom Copper Top Copper possible. The sense trace is connected to R1 at the positive terminal pad for the most accurate output possible. The bottom copper layer is mostly a ground plane with no obstructions between the ground vias. The smaller rect- angle to the left connects the input power to VIN pin 1 and input capacitor C4. The two traces at the lower left are for logic inputs FLASH and CTRL. The trace to the right is the ISET pin “sense” trace. The sense trace is routed out of the path of the returning ground current. |
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