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Preliminary
4-180
RF2352
Rev A4 010720
4
Application Schematic
Evaluation Board Schematic
(Download Bill of Materials from www.rfmd.com.)
22 nF
1500
Ω
1nF
1nF
MODE SELECT
10 nH
1nF
4pF
50
Ωµstrip
1nF
50
Ωµstrip
Package base serves as die flag ground. The vias
connecting the backside of the board should be
large in diameter to allow for easier soldering.
13
12
11
10
9
8
16
14
15
1
2
3
4
5
7
6
RF IN
V
CC
V
CC
RF OUT
V
CC
C1
22 nF
50
Ωµstrip
J1
RF IN
R1
1500
Ω
C2
1nF
VREF
C3
1nF
PD
R2*
0
Ω
R4*
0
Ω
50
Ωµstrip
L1
10 nH
VCC
C6
1nF
C5
4pF
50
Ωµstrip
J2
RF OUT
VCC
C4
1nF
50
Ωµstrip
PD
GND
VREF
P1
1
2
3
CON3
NC
GND
VCC
P2
1
2
3
CON3
* R2, R3 and R4 form a "Tee" attenuator network which
determines the gain in the bypass mode. Evaluation
boards are shipped with R2 and R4 as 0
Ω jumpers, and
R3 omitted. This configuration provides the maximum
gain (about -4 dB) available in bypass mode.
13
12
11
10
9
8
16
14
15
1
2
3
4
5
7
6
2352400-
R3*
*
OMIT
Package base serves as die flag ground. The vias
connecting the backside of the board should be large in
diameter to allow for easier soldering.
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