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Preliminary
2-7
RF3321
Rev A10 010516
3
Evaluation Board Schematic
(Download Bill of Materials from www.rfmd.com.)
C3
1nF
C4
1nF
C9
100 pF
C8
15 pF
C7
15 pF
R6
24
Ω
J7
RF OUT
VCC2
R4
75
Ω
R5
75
Ω
J6
RF IN
VCC1
C5
0.1
µF
SDA
CS
SCLK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
R1
100 k
Ω
R2
100 k
Ω
VCC
NC
CS
SDA
SCLK
SHDNB
TXEN
NC
NC
GND
GND
GND
GND
GND
GND
GND
GND
VCC
VCC
NC
NC
NC
NC
NC
NC
CS
SDA
J5-1
J3-1
SCLK
J1
J3
1
2
3
J1-6
TXEN
J2
1
2
3
VCC
GND
J5
1
2
3
J1-5
SHDNB
J4
1
2
3
VCC
GND
JP1
1
2
3
4
VCC 9V
VCC2
+
C2
1nF
L1 (Ferrite)
30
Ω
C1
10
µF
(10 V)
L3 (Ferrite)
30
Ω
L2 (Ferrite)
30
Ω
VCC
VCC1
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
Power
Control
Gain Control
and Serial Bus
PACKAGE BASE
C6
220 pF
Notes:
1. 4-layer board.
2. Underside of package must solder to ground.
3. Place C5 and C6 as close to pin as possible.
4. C1 and C10 are tantalum, size code Y.
5. All other components are 0603 size.
6. ReplaceR6with0
Ω resistor if 75 Ω connector is used.
3321400C
VCC1
GND
+
C11
1nF
L5 (Ferrite)
30
Ω
C10
10
µF
(10 V)
L4 (Ferrite)
30
Ω
VCC2
Q1
R7
R8
VCC
T1
1:1
1
2
3
6
5
4
T2
4:1
1
2
3
6
5
4
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