PACKAGE OPTION ADDENDUM

www.ti.com

17-Jul-2010

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins

Package Qty

Eco Plan

(2)

Lead/

Ball Finish

MSL Peak Temp

(3)

Samples

(Requires Login)

TUSB1105RGTR

ACTIVE

QFN

RGT

16

3000

TBD

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Request Free Samples

TUSB1105RGTRG4

ACTIVE

QFN

RGT

16

3000

TBD

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Call TI

Request Free Samples

TUSB1105RTZR

ACTIVE

WQFN

RTZ

16

3000

TBD

Call TI

Call TI

Request Free Samples

TUSB1105RTZRG4

ACTIVE

WQFN

RTZ

16

3000

TBD

Call TI

Call TI

Request Free Samples

TUSB1106PWR

ACTIVE

TSSOP

PW

16

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

Request Free Samples

TUSB1106PWRG4

ACTIVE

TSSOP

PW

16

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

Request Free Samples

TUSB1106RGTR

ACTIVE

QFN

RGT

16

3000

TBD

Call TI

Call TI

Request Free Samples

TUSB1106RGTRG4

ACTIVE

QFN

RGT

16

3000

TBD

Call TI

Call TI

Request Free Samples

TUSB1106RSVR

ACTIVE

UQFN

RSV

16

3000

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

Request Free Samples

TUSB1106RSVRG4

ACTIVE

UQFN

RSV

16

3000

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

Request Free Samples

TUSB1106RTZR

ACTIVE

WQFN

RTZ

16

3000

TBD

Call TI

Call TI

Request Free Samples

TUSB1106RTZRG4

ACTIVE

WQFN

RTZ

16

3000

TBD

Call TI

Call TI

Request Free Samples

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)