ADA4891-1/ADA4891-2/ADA4891-3/ADA4891-4

Rev. B | Page 6 of

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ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage

6 V

Input Voltage (Common Mode)

Differential Input Voltage

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +125°C

Lead Temperature (Soldering, 10 sec)

300°C

To ensure proper operation, it is necessary to observe the maxi-

mum power derating curves shown in Figure 6. These curves

the maximum safe power dissipation in the package vs. the

ambient temperature on a JEDEC standard 4-layer board.

0

0.5

1.0

2.0

1.5

–55

–35

–15

5

25

45

65

85

105

125

AMBIENT TEMPERATURE (°C)

14-LEAD TSSOP

8-LEAD SOIC_N

14-LEAD SOIC_N

5-LEAD SOT-23

8-LEAD MSOP

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the

ADA4891-1/ADA4891-2/ADA4891-3/ADA4891-4 is limited

by the associated rise in junction temperature. The maximum

safe junction temperature for plastic encapsulated devices is

determined by the glass transition temperature of the plastic,

approximately 150°C. Temporarily exceeding this limit can

cause a shift in parametric performance due to a change in the

stresses exerted on the die by the package. Exceeding a junction

temperature of 175°C for an extended period can result in

device failure.

Figure 6. Maximum Power Dissipation vs. Ambient Temperature

ADA4891-2/ADA4891-3/ADA4891-4 package.

Table 4.

Package Type

Unit

5-Lead SOT-23

146

°C/W

8-Lead SOIC_N

115

°C/W

8-Lead MSOP

133

°C/W

14-Lead SOIC_N

162

°C/W

14-Lead TSSOP

108

°C/W

The junction temperature can be calculated as

(1)

ESD CAUTION

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. It can be calculated by

(2)

where: