ADP2119/ADP2120

Rev. 0 | Page 6 of 24

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

10

EN

ADP2119/ADP2120

EXPOSED

PAD

1

VIN

9

SYNC/MODE

2

PVIN

8

PGOOD

3

SW

7

TRK

4

PGND

6

FB

5

GND

NOTES

1. THE EXPOSED PAD SHOULD BE SOLDERED TO

AN EXTERNAL GROUND PLANE UNDERNEATH

THE IC FOR THERMAL DISSIPATION.

Figure 3. Pin Configuration (Top View)

Table 4. Pin Function Descriptions

Pin No.

Mnemonic

Description

1

VIN

Bias Voltage Input Pin. Connect a bypass capacitor (0.1 μF minimum) between this pin and GND and a

small (10 Ω) resistor between this pin and PVIN.

2

PVIN

Power Input Pin. Connect this pin to the input power source. Connect a bypass capacitor between this pin and PGND.

3

SW

Switch Node Output. Connect this pin to the output inductor.

4

PGND

Power Ground. Connect this pin to the power ground plane and to the high current return for the power MOSFET.

5

GND

Analog Ground. Connect this pin to the ground plane.

6

FB

7

TRK

Tracking Input. To track a master voltage, drive TRK from a resistor divider from the master voltage. If the

tracking function is not used, connect TRK to VIN.

8

PGOOD

Power-Good Output (Open Drain). Connect this pin to a resistor to any pull-up voltage < 5.5 V.

9

SYNC/MODE

Synchronization Input (SYNC). Connect this pin to an external clock between 1 MHz and 2 MHz to synchronize

the switching frequency to the external clock (see the Oscillator and Synchronization section for details).

FPWM/PFM Selection (MODE). When this pin is connected to VIN, the PFM mode is disabled and the part works

in continuous conduction mode (CCM) only. When this pin is connected to ground, the PFM mode is enabled

and becomes active at light loads.

10

EN

Precision Threshold Enable Input Pin. An external resistor divider can be used to set the turn-on threshold. To

enable the part automatically, connect the EN pin to VIN. This pin has a 1 MΩ pull-down resistor to GND.

EPAD

Exposed Pad

The exposed pad should be soldered to an external ground plane underneath the IC for thermal dissipation.