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ADR3430ARJZ-R2 数据表(PDF) 18 Page - Analog Devices |
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ADR3430ARJZ-R2 数据表(HTML) 18 Page - Analog Devices |
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18 / 24 page ![]() ADR3412/ADR3420/ADR3425/ADR3430/ADR3433/ADR3440/ADR3450 Rev. B | Page 18 of 24 TERMINOLOGY Dropout Voltage (VDO) Dropout voltage, sometimes referred to as supply voltage headroom or supply-output voltage differential, is defined as the minimum voltage differential between the input and output such that the output voltage is maintained to within 0.1% accuracy. VDO = (VIN − VOUT)min | IL = constant Because the dropout voltage depends upon the current passing through the device, it is always specified for a given load current. In series-mode devices, dropout voltage typically increases proportionally to load current (see Figure 8 and Figure 14). Temperature Coefficient (TCVOUT) The temperature coefficient relates the change in output voltage to the change in ambient temperature of the device, as normalized by the output voltage at 25°C. This parameter is expressed in ppm/°C and can be determined by the following equation: ] / [ 10 ) ( ) ( )} , , ( min{ )} , , ( max{ 6 1 3 2 3 2 1 3 2 1 C ppm T T T V T T T V T T T V TCV OUT OUT OUT OUT ° × − × − = (1) where: VOUT(T) is the output voltage at Temperature T. T1 = −40°C. T2 = +25°C. T3 = +125°C. This three-point method ensures that TCVOUT accurately portrays the maximum difference between any of the three temperatures at which the output voltage of the part is measured. The TCVOUT for the ADR3412/ADR3425/ADR3430/ADR3433/ ADR3440/ADR3450 is guaranteed via statistical means. This is accomplished by recording output voltage data for a large number of units over temperature, computing TCVOUT for each individual device via Equation 1, then defining the maximum TCVOUT limits as the mean TCVOUT for all devices extended by six standard deviations (6σ). Thermally Induced Output Voltage Hysteresis (ΔVOUT_HYS) Thermally induced output voltage hysteresis represents the change in output voltage after the device is exposed to a specified temperature cycle. This is expressed as either a shift in voltage or a difference in ppm from the nominal output. TC OUT OUT HYS OUT V C V V _ _ ) 25 ( − ° = Δ [V] 6 _ _ 10 ) 25 ( ) 25 ( × ° − ° = Δ C V V C V V OUT TC OUT OUT HYS OUT [ppm] where: VOUT(25°C) is the output voltage at 25°C. VOUT_TC is the output voltage after temperature cycling. Long-Term Stability (ΔVOUT_LTD) Long-term stability refers to the shift in output voltage at 50°C after 1000 hours of operation in a 50°C environment. Ambient temperature is kept at 50°C to ensure that the temperature chamber does not switch randomly between heating and cooling, which can cause instability over the 1000 hour measurement. This is also expressed as either a shift in voltage or a difference in ppm from the nominal output. ) ( ) ( 0 1 _ t V t V V OUT OUT LTD OUT − = Δ [V] 6 0 0 1 _ 10 ) ( ) ( ) ( × − = Δ t V t V t V V OUT OUT OUT LTD OUT [ppm] where: VOUT(t0) is the VOUT at 50°C at Time 0. VOUT(t1) is the VOUT at 50°C after 1000 hours of operation at 50°C. Line Regulation Line regulation refers to the change in output voltage in response to a given change in input voltage and is expressed in percent per volt, ppm per volt, or μV per volt change in input voltage. This parameter accounts for the effects of self-heating. Load Regulation Load regulation refers to the change in output voltage in response to a given change in load current and is expressed in μV per mA, ppm per mA, or ohms of dc output resistance. This parameter accounts for the effects of self-heating. Solder Heat Resistance (SHR) Drift SHR drift refers to the permanent shift in output voltage induced by exposure to reflow soldering, expressed in units of ppm. This is caused by changes in the stress exhibited upon the die by the package materials when exposed to high tempera- tures. This effect is more pronounced in lead-free soldering processes due to higher reflow temperatures. |
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