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MB1S 数据表(PDF) 1 Page - Shenzhen Ping Sheng Electronics Co., Ltd. |
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MB1S 数据表(HTML) 1 Page - Shenzhen Ping Sheng Electronics Co., Ltd. |
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1 / 2 page ![]() sym MB1S - MB8S 0.5 Ampere Glass Passivated Bridge Rectifiers Absolute Maximum Ratings* T A = 25°C unless otherwise noted *These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. **Device mounted on PCB with 0.5-0.5" (13x13 mm) lead length. Electrical Characteristics T A = 25°C unless otherwise noted • • • Parameter Device Units 1S 2S 4S 6S 8S Peak Repetitive Reverse Voltage 100 200 400 600 800 V Maximum RMS Bridge Input Voltage 70 140 280 420 560 V DC Reverse Voltage (Rated VR) 100 200 400 600 800 V Maximum Reverse Leakage, per leg @ rated VR TA = 25 °C TA = 125 °C 5.0 0.5 mA mA Maximum Forward Voltage Drop, per bridge @ 0.5 A 1.0 V I 2t rating for fusing t < 8.3 ms 5.0 A 2t Typi cal Junction Capacitance, per leg VR = 4.0 V, f = 1.0 MHz 13 pF Symbol Parameter Value Units IO Average Rectified Current @ TA = 50 °C 0.5 A if(surge) Peak Forward Surge Current 8.3 ms single half-sine-wave Superimposed on rated load (JEDEC method) 35 A PD Total Device Dissipation Derate above 25 °C 1.4 11 W mW/ °C RqJA Thermal Resistance, Junction to Ambient,** per leg 85 °C/W RqJL Thermal Resistance, Junction to Lead,** per leg 20 °C/W Tstg Storage Tem perature Range -55 to +150 °C TJ Operating Junction Tem perature -55 to +150 °C Dimensions are in: inches (mm) SOIC-4 Polarity symbols molded or marking on body 0.275(7) MAX 0.165(4.2) 0.150(3.8) 0.067(1.7) 0.057(1.3) 0.067(1.7) 0.057(1.3) 0.051(1.3) 0.035(0.9) 0.014(0.35) 0.006(0.15) 0.043(1.1) 0.027(0.7) C0.02(0.5) 0.008(0.2) 0.118(3.0) MAX 0.106(2.7) 0.09(2.3) 0.031(0.8) 0.0191(0.5) 0.106(2.7) 0.09(2.3) 0.193(4.9) 0.177(4.5) 4 3 1 2 –– + ~ 1 2 3 4 : : : : –– + ~ ~ ~ Web Site: WWW.PS-PFS.COM Low Profile Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifier VOLTAGE - 50 TO 1000 VOLTS CURRENT - 0.5 AMPERES Low profile space Ideal for automated placement Glass passivated chip junction Low forward voltage drop Low leakage current High forward surge capability High temperature soldering: 260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC FEATURES • • • • • Case: MBF Molded plastic over glass passivated chip Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D Polarit : Polarit bols marked on MECHANICAL DATA • • • |
类似零件编号 - MB1S |
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类似说明 - MB1S |
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