IPS2041(L)(R)PbF

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters

are referenced to Ground lead. (Tambient=25°C unless otherwise specified).

Symbol

Parameter

Min.

Max.

Units

Vds

Maximum drain to source voltage

-0.3

60

V

Vds cont.

Maximum continuous drain to source voltage

-

35

V

Vin

Maximum input voltage

-0.3

6

V

Isd cont.

Max diode continuous current (limited by thermal dissipation) Rth=125°C/W

⎯

1.4

A

Maximum power dissipation (internally limited by thermal protection)

Pd

Rth=125C°/W

⎯

1

W

Electrostatic discharge voltage (Human body) C=100pF, R=1500

Ω

Between drain and source

⎯

4

Other combinations

⎯

3

Electrostatic discharge voltage (Machine Model) C=200pF,R=0

Ω

Between drain and source

⎯

0.5

ESD

Other combinations

⎯

0.3

kV

Tj max.

Max. storage & operating temperature junction temperature

-40

150

°C

Thermal Characteristics

Symbol

Parameter

Typ.

Max.

Units

Rth1

Thermal resistance junction to ambient IPS2041L

100

⎯

Rth2

Thermal resistance junction to ambient with 1” square footprint

50

⎯

Rth1

Thermal resistance junction to ambient IPS2041R D-Pak std. footprint

70

⎯

Rth2

Thermal resistance junction to ambient IPS2041R D-Pak 1” sqr. footprint

50

⎯

Rth3

Thermal resistance junction to case IPS2041R D-Pak

4

⎯

°C/W

Recommended Operating Conditions

These values are given for a quick design. For operation outside these conditions, please consult the application notes.

Symbol

Parameter

Min.

Max.

Units

VIH

High level input voltage

4

5.5

VIL

Low level input voltage

0

0.5

Ids

Continuous drain current, Tambient=85°C, Tj=125°C, Vin=5V,Rth=100°C/W

⎯

1.4

A

Rin

Recommended resistor in series with IN pin to generate a diagnostic

0.5

5

Max L

Max recommended load inductance (including line inductance) (1)

⎯

10

mH

Max. t rise

Max. input rising time

⎯

1

µs

(1) Higher inductance is possible if maximum load current is limited - see figure 11

www.irf.com

2