PESD1FLEX_2

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 02 — 15 February 2008

9 of 12

NXP Semiconductors

PESD1FLEX

FlexRay bus ESD protection diode

10. Soldering

Fig 10. Reflow soldering footprint SOT23 (TO-236AB)

Fig 11. Wave soldering footprint SOT23 (TO-236AB)

solder resist

occupied area

solder lands

solder paste

Dimensions in mm

sot023

1.00

0.60

(3x)

1.30

1

2

3

2.50

3.00

0.85

2.70

2.90

0.50 (3x)

0.60 (3x)

3.30

0.85

sot023

4.00

4.60

2.80

4.50

1.20

3.40

3

21

1.20 (2x)

preferred transport direction during soldering

Dimensions in mm

solder resist

occupied area

solder lands