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STP3NK80Z 数据表(PDF) 3 Page - STMicroelectronics |
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STP3NK80Z 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 18 page ![]() STD3NK80Z, STD3NK80Z-1, STF3NK80Z, STP3NK80Z Electrical ratings Doc ID 9565 Rev 6 3/18 1 Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit TO-220, DPAK IPAK TO-220FP VDS Drain-source voltage (VGS = 0) 800 V VDGR Drain-gate voltage (RGS = 20 kΩ)800 V VGS Gate-source voltage ± 30 V ID Drain current (continuous) at TC = 25 °C 2.5 2.5 (1) 1. Limited only by maximum temperature allowed A ID Drain current (continuous) at TC=100 °C 1.57 1.57 (1) A IDM (2) 2. Pulse width limited by safe operating area Drain current (pulsed) 10 10 (1) A PTOT Total dissipation at TC = 25 °C 70 25 W Derating factor 0.56 0.2 W/°C VESD(G-S) Gate source ESD (HBM-C=100 pF, R=1.5 k Ω) 2000 V dv/dt (3) 3. ISD ≤ 2.5 A, di/dt ≤ 200 A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX. Peak diode recovery voltage slope 4.5 V/ns VISO Insulation withstand voltage (DC) 2500 V TJ Tstg Operating junction temperature Storage temperature -55 to 150 °C Table 3. Thermal data Symbol Parameter Value Unit TO-220 TO-220FP DPAK IPAK Rthj-case Thermal resistance junction-case max 1.78 5 1.78 °C/W Rthj-a Thermal resistance junction-ambient max 62.5 100 °C/W Tl Maximum lead temperature for soldering purpose 300 °C |
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