L6730 datasheet(49/52 Pages) STMICROELECTRONICS

49 / 52 page

L6730 - L6730B

Package mechanical data

Doc ID 11938 Rev 3

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Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK is an ST trademark.

Table 14.

HTSSOP20 mechanical data

Dim.

inch

Min.

Typ.

Max.

Min.

Typ.

Max.

1.200

0.047

0.150

0.006

0.800

1.000

1.050

0.031

0.039

0.041

0.190

0.300

0.007

0.012

0.090

0.200

0.003

0.008

D(1)

Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs

shall not exceed 0.15mm per side.

6.400

6.500

6.600

0.252

0.256

0.260

D1(3)

2.200

0.087

6.200

6.400

6.600

0.244

0.252

0.260

E1(2)

Dimension “E1” does not include interlead flash or protrusions. Intelead flash or protrusions shall not

exceed 0.25mm per side.

4.300

4.400

4.500

0.170

0.173

0.177

(3)

The size of exposed pad is variable depending of leadframe design pad size. End user should verify “D1”

and “E2” dimensions for each device application.

1.500

0.059

0.650

0.025

0.450

0.600

0.750

0.018

0.024

0.030

1.000

0.039

0° min., 8° max.

aaa

0.100

0.004

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