M95256-D-CS3TGSLASHA datasheet(39/48 Pages) STMICROELECTRONICS

39 / 48 page

M95256-DR, M95256, M95256-W, M95256-R

Package mechanical data

Doc ID 12276 Rev 11

39/48

Package mechanical data

In order to meet environmental requirements, ST offers the M95256 in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at www.st.com.

Figure 23.

SO8N – 8 lead plastic small outline, 150 mils body width, package outline

Drawing is not to scale.

Table 21.

SO8N – 8 lead plastic small outline, 150 mils body width, package data

Symbol

millimeters

inches(1)

Values in inches are converted from mm and rounded to 4 decimal digits.

Typ

Min

Max

Typ

Min

Max

1.75

0.0689

0.1

0.25

0.0039

0.0098

1.25

0.0492

0.28

0.48

0.011

0.0189

0.17

0.23

0.0067

0.0091

ccc

0.1

0.0039

4.9

4.8

0.1929

0.189

0.1969

5.8

6.2

0.2362

0.2283

0.2441

3.9

3.8

0.1535

0.1496

0.1575

e1.27

0.05

0.25

0.5

0.0098

0.0197

0°8°

0.4

1.27

0.0157

0.05

1.04

0.0409

SO-A

ccc

h x 45˚

0.25 mm

GAUGE PLANE

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