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M24M01-R 数据表(PDF) 29 Page - STMicroelectronics |
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M24M01-R 数据表(HTML) 29 Page - STMicroelectronics |
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29 / 37 page ![]() M24M01-R, M24M01-W, M24M01-HR Package mechanical data Doc ID 12943 Rev 7 29/37 Figure 16. WLCSP8 – Wafer level chip scale package outline 1. Drawing is not to scale and corresponds to preliminary data. 2. The dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. The primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. Table 17. WLCSP8 – Wafer level chip scale package mechanical data(1) 1. Preliminary data. Symbol millimeters inches(2) 2. Values in inches are converted from mm and rounded to 4 decimal digits. Typ Min Max Typ Min Max A 0.580 0.555 0.605 0.0228 0.0219 0.0238 A1 0.230 0.0091 A2 0.350 0.0138 b 0.322 0.0127 D 3.570 3.685 0.1406 0.1451 E 2.050 2.165 0.0807 0.0852 e 0.600 0.0236 e1 2.400 0.0945 e2 1.200 0.0472 F 0.585 0.0230 G 0.424 0.0167 aaa 0.110 0.0043 bbb 0.110 0.0043 ccc 0.110 0.0043 ddd 0.060 0.0024 eee 0.060 0.0024 N (number of bumps) 8 Orientation reference Wafer’s back side Side view Bump side Orientation reference Detail A Bump Seating plane(3) Detail A rotated by 90° D E A2 A F e1 e2 e e2 G A1 b(8X)(2) Note 4 (4X) eee Z Z aaa E1_ME |
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