BYD77DA datasheet(1/3 Pages) EIC

部件名	BYD77DA

功能描述	ULTRA FAST LOW-LOSS CONTROLLED AVALANCHE RECTIFIERS

PDF	3 Pages

Scroll/Zoom	100%

制造商	EIC [EIC discrete Semiconductors]

网页	http://www.eicsemi.com

标志

1 / 3 page

BYD77AA - BYD77GA

ULTRA FAST LOW-LOSS

CONTROLLED AVALANCHE RECTIFIERS

PRV : 50 - 400 Volts

Io : 2.0 Amperes

FEATURES :

* Glass passivated junction chip

* High maximum operating temperature

* Low leakage current

* Excellent stability

* Smallest surface mount rectifier outline

* Pb / RoHS Free

MECHANICAL DATA :

* Case : SMA Molded plastic

* Epoxy : UL94V-O rate flame retardant

* Lead : Lead Formed for Surface Mount

* Polarity : Color band denotes cathode end

* Mounting position : Any

* Weight : 0.067 gram

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Rating at 25 °C ambient temperature unless otherwise specified

BYD

77AA 77BA 77CA 77DA 77EA 77FA 77GA

Maximum Repetitive Peak Reverse Voltage

VRRM

50

100

150

200

250

300

400

V

Maximum Continuous Reverse Voltage

VR

50

100

150

200

250

300

400

V

Min. Reverse Avalanche Breakdown Voltage @ IR = 0.1 mA

V(BR)R-min

55

110

165

220

275

330

440

V

Maximum Average Forward Current

Maximum Non-Repetitive Peak Forward Surge Current (Note 3)

IFSM

A

Maximum Repetitive Peak Forward Current at Ttp = 105 °C

IFRM

A

Maximum Forward Voltage at IF = 1.0 A ; TJ = 25 °C

VF

V

Maximum Reverse Current at VR =VRRMmax

TJ = 25 °C

IR

μA

TJ = 165 °C

IR(H)

μA

Maximum Reverse Recovery Time (Note 4)

Trr

ns

Thermal Resistance from Junction to Tie-Point

Rth j-tp

K / W

Thermal Resistance from Junction to Ambient (Note 5)

Rth j-a

K / W

Junction Temperature Range

TJ

°C

Storage Temperature Range

TSTG

°C

Notes :

(1) Ttp = 105 °C; see Fig. 1and 2; averaged over any 20 ms period; see also Fig.5 and 6

(2) Tamb = 60 °C; PCB mounting ; see Fig. 3 and 4; averaged over any 20 ms period; see also Fig.5 and 6

(3) t=10ms half sine wave; Tj = Tjmax prior to surge; VR = VRRMmax

(4) Reverse Recovery Test Conditions : IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A.

(5) Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≤ 40 μm.

Page 1 of 3

Rev. 00 : February 13, 2008

UNIT

15

13

SYMBOL

RATING

25

2.0

(1)

1.85

(1)

IF(AV)

A

0.85

(2)

0.80

(2)

- 65 to + 175

0.98

1.05

1.0

100

25

50

30

150

- 65 to + 175

2.0

± 0.2

2.1

± 0.2

SMA (DO-214AC)

1.2

± 0.2

2.6

± 0.15

Dimensions in millimeters

1.1

± 0.3

0.2

± 0.07

IATF 0060636

SGS TH07/1033

TW00/17276EM

TH97/10561QM

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