BSP89 datasheet(2/8 Pages) INFINEON

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BSP89

Rev. 2.1

Thermal Characteristics

Parameter

Symbol

Values

Unit

min.

typ.

max.

Characteristics

Thermal resistance, junction - soldering point

(Pin 4)

RthJS

K/W

SMD version, device on PCB:

@ min. footprint

@ 6 cm2 cooling area 1)

RthJA

115

Electrical Characteristics, at Tj = 25 °C, unless otherwise specified

Parameter

Symbol

Values

Unit

min.

typ.

max.

Static Characteristics

Drain-source breakdown voltage

VGS=0, ID=250µA

V(BR)DSS 240

Gate threshold voltage, VGS = VDS

ID=108µA

VGS(th)

0.8

1.4

1.8

Zero gate voltage drain current

VDS=240V, VGS=0, Tj=25°C

VDS=240V, VGS=0, Tj=150°C

IDSS

0.1

µA

Gate-source leakage current

VGS=20V, VDS=0

IGSS

Drain-source on-state resistance

VGS=4.5V, ID=0.32A

RDS(on)

4.9

7.5

Drain-source on-state resistance

VGS=10V, ID=0.35A

RDS(on)

4.2

1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain

connection. PCB is vertical without blown air.

200

08-18

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