ADA4424-6

Rev. C | Page 6 of 16

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

3.3 V Supply Voltage

3.6 V

5 V Supply Voltage

5.5 V

Digital Input Voltage (Pin 2 to Pin 5, Pin 8,

Pin 12, Pin 15, Pin 16, Pin 23)

3.6 V

Power Dissipation

See Figure 2

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

150°C

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

depends on the particular application. For each output, the

power due to load drive is calculated by multiplying the load

current by the associated voltage drop across the device. The

power dissipated due to the loads is equal to the sum of the

power dissipations due to each individual load. RMS voltages

and currents must be used in these calculations.

Figure 2 shows the maximum power dissipation in the package

vs. the ambient temperature for the 38-lead TSSOP (67.6°C/W)

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

2.4

0

0

100

AMBIENT TEMPERATURE (°C)

2.2

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

10

20

30

40

50

60

70

80

90

THERMAL RESISTANCE

conductivity 4-layer (2s2p) circuit board, as described in

EIA/JESD 51-7.

Table 3.

Package Type

Unit

38-Lead TSSOP

67.6

14.0

°C/W

MAXIMUM POWER DISSIPATION

Figure 2. Maximum Power Dissipation vs.

Ambient Temperature for a 4-Layer Board

The maximum safe power dissipation in the ADA4424-6

package is limited by the associated rise in junction temperature

transition temperature, the plastic changes its properties. Even

temporarily exceeding this temperature limit can change the

stresses that the package exerts on the die, permanently shifting

the parametric performance of the ADA4424-6. Exceeding a

junction temperature of 150°C for an extended time can result

in changes in the silicon devices, potentially causing failure.

ESD CAUTION