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IPD60R385CP 数据表(PDF) 2 Page - Infineon Technologies AG |
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IPD60R385CP 数据表(HTML) 2 Page - Infineon Technologies AG |
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2 / 10 page ![]() IPD60R385CP Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Conditions Unit Continuous diode forward current I S A Diode pulse current 2) I S,pulse 27 Reverse diode dv /dt 4) dv /dt 15 V/ns Parameter Symbol Conditions Unit min. typ. max. Thermal characteristics Thermal resistance, junction - case R thJC - - 1.5 K/W R thJA SMD version, device on PCB, minimal footprint -- 62 SMD version, device on PCB, 6 cm 2 cooling area 5) -35- Soldering temperature, reflowsoldering T sold reflow MSL3 - - 260 °C Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0 V, I D=250 µA 600 - - V Gate threshold voltage V GS(th) V DS=V GS, I D=0.34 mA 2.5 3 3.5 Zero gate voltage drain current I DSS V DS=600 V, V GS=0 V, T j=25 °C -- 1 µA V DS=600 V, V GS=0 V, T j=150 °C -10- Gate-source leakage current I GSS V GS=20 V, V DS=0 V - - 100 nA Drain-source on-state resistance R DS(on) V GS=10 V, I D=5.2 A, T j=25 °C - 0.35 0.385 Ω V GS=10 V, I D=5.2 A, T j=150 °C - 0.94 - Gate resistance R G f =1 MHz, open drain - 1.8 - Ω Value T C=25 °C 5.2 Values Thermal resistance, junction - ambient Rev. 2.2 page 2 2009-04-15 |
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