© Semiconductor Components Industries, LLC, 2002

October, 2002 − Rev. 01O

1

Case Outline Number:

485M

QFN52 8x8, 0.5P

CASE 485M−01

ISSUE C

DATE 16 FEB 2010

C

0.15

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.25 AND 0.30

MM FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

A

D

E

B

C

0.08

A1

A3

A

D2

L

NOTE 3

C

0.15

2X

2X

SEATING PLANE

C

0.10

A2

C

E2

52 X

e

1

13

14

26

27

39

40

52

b

52 X

A

0.10

B

C

0.05 C

DIM

MIN

MAX

MILLIMETERS

A

0.80

1.00

A1

0.00

0.05

A2

0.60

0.80

A3

0.20 REF

b

0.18

0.30

D

8.00 BSC

D2

6.50

6.80

E

8.00 BSC

E2

6.50

6.80

e

0.50 BSC

K

0.20

---

REF

K

52 X

152

XXXXXXXXX = Device Code

A

= Assembly Site

WL

= Wafer Lot

YY

= Year

WW

= Work Week

G

= Pb−Free Package

XXXXXXXXX

XXXXXXXXX

AWLYYWWG

L

0.30

0.50

SCALE 2:1

1

GENERIC MARKING

DIAGRAM

PIN ONE

REFERENCE

SOLDERING FOOTPRINT

DIMENSIONS: MILLIMETERS

8.30

6.75

6.75

0.50

0.62

0.30

52X

52X

PITCH

8.30

PKG

OUTLINE

RECOMMENDED

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

http://onsemi.com

1

© Semiconductor Components Industries, LLC, 2002

October, 2002 − Rev. 0

Case Outline Number:

XXX

DOCUMENT NUMBER:

STATUS:

NEW STANDARD:

DESCRIPTION:

98AON12057D

ON SEMICONDUCTOR STANDARD

52 PIN QFN, 8X8, 0.5P

Electronic versions are uncontrolled except when

accessed directly from the Document Repository. Printed

versions are uncontrolled except when stamped

“CONTROLLED COPY” in red.

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