STPS0540Z / STPS0560Z

4/5

0

5

10 15 20 25 30 35 40 45 50 55 60

1E-4

1E-3

1E-2

1E-1

1E+0

1E+1

5E+1

VR(V)

IR(mA)

Tj=70°C

Tj=25°C

Tj=100°C

Tj=125°C

Fig. 5-2: Reverse leakage current versus reverse

voltage applied (typical values).(STPS0560Z)

0

25

50

75

100

125

1E-1

1E+0

1E+1

1E+2

1E+3

Tj(°C)

IR[Tj] / IR[Tj=25°C]

VR=VRRM

Fig. 6: Reverse leakage current versus junction

temperature (typical values).

12

5

10

20

40

60

10

20

50

100

200

VR(V)

C(pF)

F=1MHz

Tj=25°C

STPS0540Z

STPS0560Z

Fig. 7: Junction capacitance versus reverse volt-

age applied (typical values).

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1

1E-3

1E-2

1E-1

1E+0

5E+0

VFM(V)

IFM(A)

Tj=25°C

Tj=100°C

Tj=100°C

Typical values

Fig. 8-1: Forward voltage drop versus forward cur-

rent (maximum values).(STPS0540Z)

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2

1E-3

1E-2

1E-1

1E+0

5E+0

VFM(V)

IFM(A)

Tj=100°C

Typical values

Tj=100°C

Tj=25°C

Fig. 8-2: Forward voltage drop versus forward cur-

rent (maximum values).(STPS0560Z)

0

20406080

100

100

150

200

250

300

350

S(Cu) (mm²)

Rth(j-a) (°C/W)

P=0.25W

Fig. 9: Variation of thermal resistance junction to

ambient versus copper surface under each lead

(Printed circuit board FR4, e(Cu) = 35µm).