STTH1L06

Characteristics

Doc ID 8321 Rev 4

5/9

Figure 15.

Thermal resistance junction to ambient versus copper surface under each lead

(Epoxy printed circuit board FR4, copper thickness: 35 µm)

Figure 11.

Transient peak forward voltage

Figure 12.

(90% confidence)

0

5

10

15

20

25

0

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60

80

100

120

140

160

180

200

dIF/dt(A/µs)

IF=IF(av)

Tj=125°C

VFP(V)

0

20

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180

200

0

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180

200

dIF/dt(A/µs)

IF=IF(av)

VFR=1.1 x VF max.

Tj=125°C

tfr(ns)

Figure 13.

Junction capacitance versus

reverse voltage applied

(typical values)

Figure 14.

Thermal resistance junction to

ambient versus copper surface

under each lead

1

10

100

1

10

100

1000

VR(V)

F=1MHz

Vosc=30mV

Tj=25°C

C(pF)

0

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110

0123456789

10

S(cm²)

DO-41

Lleads=10mm

SMB

Rth(j-a)(°C/W)

Epoxy printed circuit board FR4, copper thickness: 35 µm

0

10

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140

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

S(cm²)

SMA

Rth(j-a)(°C/W)