Obsolete

Product(s)

- Obsolete

Product(s)

STV8162

Power dissipation and layout indications

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5

Power dissipation and layout indications

The power is mainly dissipated by the three device buffers. It can be calculated by the

equation:

sink and the corresponding maximum power dissipation assuming:

●

Maximum ambient temperature = 70° C

●

Maximum junction temperature = 140° C

Figure 8.

Thermal resistance (junction-to-ambient) of DIP18 package without heatsink

Figure 9.

Metal plate mounted near STV8162D for heatsinking

Table 5.

Power dissipation

Device

Heat Sink

STV8162

No

50

1.4

Yes

15

4.6

STV8162D

No

56 to 40

1.25 to 1.75

Yes

32

2.2

Copper area (cm²) (35 µm plus solder) Board is face-down

To optimize the thermal conductivity of the copper

layer and the exchanges with the air, the solder

must cover the maximum amount of this area.

60

40

50

10

12

0

55

45

24

8

6

Test Board with

“On Board” square heat sink area.

Top View

Bottom View