iC-LSC

12-CHANNEL ACTIVE PHOTOSENSOR ARRAY

Rev C1, Page 4/7

ABSOLUTE MAXIMUM RATINGS

These ratings do not imply operating conditions; functional operation is not guaranteed. Beyond these ratings device damage may occur.

Item

Symbol

Parameter

Conditions

Unit

No.

Min.

Max.

G001 VCC

Voltage at VCC

-0.3

6

V

G002 I(VCC)

Current in VCC

-20

20

mA

G003 V()

Pin Voltage, all signal outputs

-0.3

VCC+0.3

V

G004 I()

Pin Current, all signal outputs

-20

20

mA

G005 Vd()

ESD Susceptibility, all pins

HBM, 100 pF discharged through 1.5 kΩ

2

kV

G006 Tj

Junction Temperature

-40

150

°C

G007 Ts

Chip Storage Temperature

-40

150

°C

THERMAL DATA

Item

Symbol

Parameter

Conditions

Unit

No.

Min.

Typ.

Max.

T01

Ta

Operating Ambient Temperature Range package oBGA LS2C

-20

90

°C

package oQFN32-N5x5*

-40

110

°C

(extended temperature range on request)

T02

Ts

Storage Temperature Range

package oBGA LS2C

-30

110

°C

package oQFN32-N5x5*

-40

110

°C

T03

Tpk

Soldering Peak Temperature

package oBGA LS2C

tpk < 20 s, convection reflow

245

°C

tpk < 20 s, vapor phase soldering

230

°C

TOL (time on label) 8 h;

Please refer to customer information file No. 7

for details.

T04

Tpk

Soldering Peak Temperature

package oQFN32-N5x5*

tpk < 20 s, convection reflow

245

°C

tpk < 20 s, vapor phase soldering

230

°C

MSL 5A (max. floor live 24 h at 30 °C and

60 % RH);

Please refer to customer information file No. 7

for details.

*) Package qualification pending.

All voltages are referenced to ground unless otherwise stated.

All currents flowing into the device pins are positive; all currents flowing out of the device pins are negative.