ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.

These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave

soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming

Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

AP02001 Rev. 38

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Suggested Pad Layout

© Diodes Incorporated

DFN2020-3

DFN2020B-3

X1

C

X3

X

Y4

Y1

X2

Y

Y2

Y3

R3

R2

R1

G

Dimensions

Value (in mm)

C

1.00

G

0.15

X

1.40

X1

0.35

X2

0.45

X3

0.322

Y

1.10

Y1

0.60

Y2

0.45

Y3

0.45

Y4

0.698

R1

0.225

R2

0.05

R3

0.20

X

Y1

Y

Y2

X1

C

G

Dimensions

Value (in mm)

C

1.30

G

0.24

X

0.35

X1

1.52

Y

1.09

Y1

0.47

Y2

0.50

DFN2020-6

DFN2020B-6

G

G

YC

Z

Y

X2

X1

Dimensions Value (in mm)

Z

1.67

G

0.15

X1

0.90

X2

0.45

Y

0.37

C

0.65

G

G

Y

C

Z

Y1

X2

X1

G1

Dimensions Value (in mm)

Z

1.67

G

0.20

G1

0.40

X1

1.0

X2

0.45

Y

0.37

Y1

0.70

C

0.65

DFN3020B-8

C

X1

G1

X

Y1

Y

Y2

G

Dimensions

Value (in mm)

C

0.650

G

0.285

G1

0.090

X

0.400

X1

1.120

Y

0.730

Y1

0.500

Y2

0.365