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AP7331 数据表(PDF) 4 Page - Diodes Incorporated

部件名 AP7331
功能描述  300mA, LOW QUIESCENT CURRENT, FAST TRANSIENT LOW DROPOUT
PDF  13 Pages
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制造商  DIODES [Diodes Incorporated]
网页  http://www.diodes.com
标志 DIODES - Diodes Incorporated

AP7331 数据表(HTML) 4 Page - Diodes Incorporated

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AP7331
300mA, LOW QUIESCENT CURRENT, FAST TRANSIENT
LOW DROPOUT LINEAR REGULATOR
AP7331
Document number: DS31914 Rev. 3 - 2
4 of 13
www.diodes.com
January 2011
© Diodes Incorporated
Electrical Characteristics
(TA = 25
oC, V
IN = VOUT +1V, CIN = 1uF, COUT = 1uF, VEN = 2V, unless otherwise stated)
Symbol
Parameter
Test Conditions
Min
Typ.
Max
Unit
IQ
Input Quiescent Current
VEN = VIN, IOUT = 0mA
55
75
μA
VEN = VIN, IOUT = 300mA
65
85
ISHDN
Input Shutdown Current
VEN = 0V, IOUT = 0mA
1
μA
ILEAK
Input Leakage Current
VEN = 0V, OUT grounded
1
μA
VDropout
Dropout Voltage (Note 4)
IOUT = 300mA
300
550
mV
VREF
ADJ Reference Voltage (Adjustable version)
IOUT= 0mA
0.4
V
IADJ
ADJ Leakage (Adjustable version)
1
μA
VOUT
Output Voltage Accuracy
TA = -40
oC to 85oC,
IOUT = 30mA
-2
2
%
ΔV
OUT
/
ΔV
IN/V
Line Regulation
VIN = (VOUT +1V) to VIN-Max,
VEN = VIN, IOUT = 1mA
0.01
0.20
%/V
ΔV
OUT
/VOUT
Load Regulation
VIN = (VOUT +1V) to VIN-Max,
IOUT from 1mA to 300mA
-0.6
0.6
%
tST
Start-up Time
VEN = 0V to 2.0V, VOUT = 1V,
IOUT = 300mA
80
μs
PSRR
PSRR
VIN = [VOUT +1V]VDC + 0.5VppAC,
f = 100Hz, IOUT =30mA
65
dB
ISHORT
Short-circuit Current
VIN = VIN-Min to VIN-Max,
VOUT < 0.2V
100
mA
ILIMIT
Current Limit
VOUT/ROUT = 1A
400
600
mA
VIL
EN Input Logic Low Voltage
VIN = VIN-Min to VIN-Max
0.4
V
VIH
EN Input Logic High Voltage
VIN = VIN-Min to VIN-Max
1.4
V
IEN
EN Input Current
VIN = 0V or VIN-Max
-1
1
μA
TSHDN
Thermal Shutdown Threshold
140
°C
THYS
Thermal Shutdown Hysteresis
15
°C
θJA
Thermal Resistance Junction-to-Ambient
SOT25 (Note 5)
190
oC/W
DFN2020-6 (Note 6)
167
oC/W
Notes:
4. Dropout voltage is the voltage difference between the input and the output at which the output voltage drops 2% below its nominal value.
This parameter only applies to output voltages above 1.8V.
5. Test conditions for SOT25: Device mounted on FR-4 substrate PCB, with minimum recommended pad layout, 2oz copper, single sided
6. Test conditions for DFN2020-6: Device mounted on FR-4 substrate PCB, with minimum recommended pad layout, 2oz copper, double sided,
bottom layer is a copper plane.



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