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MMSZ5259B 数据表(PDF) 1 Page - Diodes Incorporated |
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MMSZ5259B 数据表(HTML) 1 Page - Diodes Incorporated |
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1 / 5 page  MMSZ5221B - MMSZ5259B Document number: DS18010 Rev. 23 - 2 1 of 5 www.diodes.com May 2009 © Diodes Incorporated MMSZ5221B - MMSZ5259B 500mW SURFACE MOUNT ZENER DIODE Features • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Lead, Halogen and Antimony Free, RoHS Compliant (Note 3) • "Green" Device (Note 4) • Qualified to AEC-Q101 Standards for High Reliability Mechanical Data • Case: SOD-123 • Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020D • Terminals: Matte Tin Finish annealed over Alloy 42 leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 • Polarity: Cathode Band • Ordering Information: See Page 3 • Marking Information: See Page 3 • Weight: 0.01 grams (approximate) Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Symbol Value Unit Forward Voltage @ IF = 10mA VF 0.9 V Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 1) @TL = 75°C PD 500 mW Thermal Resistance, Junction to Ambient Air (Note 1) RθJA 350 °C/W Thermal Resistance, Junction to Lead (Note 2) RθJL 150 °C/W Operating and Storage Temperature Range TJ, TSTG -65 to +150 °C Notes: 1. Device mounted on FR-4 substrate, single-sided, PC boards, with minimum recommended pad layout. 2. Thermal Resistance measurement obtained via infrared scan method. 3. No purposefully added lead. Halogen and Antimony Free. 4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. Top View Please click here to visit our online spice models database. |
类似零件编号 - MMSZ5259B |
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类似说明 - MMSZ5259B |
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