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MMBZ5259B 数据表(PDF) 1 Page - Diodes Incorporated

部件名 MMBZ5259B
功能描述  350mW SURFACE MOUNT ZENER DIODE
PDF  5 Pages
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制造商  DIODES [Diodes Incorporated]
网页  http://www.diodes.com
标志 DIODES - Diodes Incorporated

MMBZ5259B 数据表(HTML) 1 Page - Diodes Incorporated

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MMBZ5221B - MMBZ5259B
Document number: DS18011 Rev. 21 - 2
1 of 5
www.diodes.com
August 2010
© Diodes Incorporated
MMBZ5221B - MMBZ5259B
350mW SURFACE MOUNT ZENER DIODE
Features
•
Planar Die Construction
•
350mW Power Dissipation on FR-4 PCB
•
General Purpose, Medium Current
•
Ideally Suited for Automated Assembly Processes
•
Lead, Halogen and Antimony Free, RoHS Compliant "Green"
Device (Notes 2 and 3)
•
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
•
Case: SOT-23
•
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020
•
Terminal Connections: See Diagram
•
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
•
Marking Information: See Page 4
•
Ordering Information: See Page 4
•
Weight: 0.008 grams (approximate)
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Forward Voltage
@ IF = 10mA
VF
0.9
V
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 1)
PD
350
mW
Thermal Resistance, Junction to Ambient Air (Note 1)
RθJA
357
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-65 to +150
°C
Notes:
1. Mounted on FR4 PC Board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf
2. No purposefully added lead. Halogen and Antimony Free.
3. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
Top View
Device Schematic


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