MMBZ5221BS - MMBZ5259BS

200mW SURFACE MOUNT ZENER DIODE

Features

•

Planar Die Construction

•

Dual Isolated Zeners in Ultra-Small Surface Mount Package

•

Ideally Suited for Automated Assembly Processes

•

Lead Free/RoHS Compliant (Note 2)

•

"Green" Device (Note 3 and 4)

Mechanical Data

•

Case: SOT-363

•

Case Material: Molded Plastic. UL Flammability Classification

Rating 94V-0

•

Moisture Sensitivity: Level 1 per J-STD-020D

•

Terminals: Solderable per MIL-STD-202, Method 208

•

Lead Free Plating (Matte Tin Finish annealed over Alloy 42

leadframe).

•

Polarity: See Diagram

•

Marking Information: See Page 4

•

Ordering Information: See Page 4

•

Weight: 0.006 grams (approximate)

C

1

A

1

C

2

A

2

NC

NC

Top View

Device Schematic

Characteristic

Symbol

Value

Unit

Forward Voltage

0.9

V

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Power Dissipation

(Note 1)

200

mW

Thermal Resistance, Junction to Ambient Air

(Note 1)

625

°C/W

Operating and Storage Temperature Range

-65 to +150

°C

Notes:

1.

Mounted on FR4 PC Board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.

2.

No purposefully added lead.

3.

Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

4.

Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

MMBZ5221BS - MMBZ5259BS

Document number: DS31039 Rev. 15 - 2

1 of 4

www.diodes.com

June 2008

© Diodes Incorporated

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