AD8224HACPZ-R7 datasheet(9/28 Pages) AD

9 / 28 page

AD8224

Rev. B | Page 9 of 28

ABSOLUTE MAXIMUM RATINGS

Table 8.

Parameter

Rating

Supply Voltage

±18 V

Power Dissipation

See Figure 2

Output Short-Circuit Current

Indefinite1

Input Voltage (Common Mode)

±VS

Differential Input Voltage

±VS

Storage Temperature Range

−65°C to +130°C

Operating Temperature Range2

−40°C to +125°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

130°C

Package Glass Transition Temperature

130°C

ESD (Human Body Model)

4 kV

ESD (Charge Device Model)

1 kV

ESD (Machine Model)

0.4 kV

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

1 Assumes the load is referenced to midsupply.

2 Temperature for

85°C. For performance

to 125°C, see the

section.

specified performance is −40°C to +

Typical Performance Characteristics

THERMAL RESISTANCE

Table 9.

Exposed Paddle Package

θJA

Unit

CP-16-13: LFCSP Soldered to Board

°C/W

CP-16-13: LFCSP Not Soldered to Board

°C/W

Table 10

Hidden Paddle Package

θJA

Unit

CP-16-19: LFCSP

°C/W

The θJA values in Table 9 and Table 10 assume a 4-layer JEDEC

standard board. If the thermal pad is soldered to the board, it is

also assumed it is connected to a plane. θJC at the exposed pad is

4.4°C/W.

Maximum Power Dissipation

The maximum safe power dissipation for the AD8224 is limited

by the associated rise in junction temperature (TJ) on the die. At

approximately 130°C, which is the glass transition temperature,

the plastic changes its properties. Even temporarily exceeding

this temperature limit may change the stresses that the package

exerts on the die, permanently shifting the parametric performance

of the amplifiers. Exceeding a temperature of 130°C for an

extended period can result in a loss of functionality. Figure 2

shows the maximum safe power dissipation in the package vs.

the ambient temperature for the LFCSP on a 4-layer JEDEC

standard board.

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

–60

–40

–20

100

120

140

AMBIENT TEMPERATURE (°C)

θJA = 48°C/W WHEN THERMAL PAD

IS SOLDERED TO BOARD

θJA = 86°C/W WHEN THERMAL PAD

IS NOT SOLDERED TO BOARD

Figure 2. Maximum Power Dissipation vs. Ambient Temperature

ESD CAUTION

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