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Vishay Sfernice

Revision: 14-Jan-15

4

Document Number: 53050

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

POPULAR OPTIONS

It is recommended to consult Vishay Sfernice for availability first.

Option: Enlarged terminations:

For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint

can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heatsink

(see application note: 53048 “Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film, PRA

Option to order: 0063 (applies to size 1206 / 2010).

DIMENSIONS (Option 0063) in millimeters

SUGGESTED LAND PATTERN (Option 0063)

CASE SIZE

AB

E

D

F

MAX. TOL.

+0.152

MIN. TOL.

-0.152

MAX. TOL.

+0.127

MIN. TOL.

-0.127

MAX. TOL.

+0.13

MIN. TOL.

-0.13

MAX. TOL.

+0.13

MIN. TOL.

-0.13

NOMINAL

NOMINAL

NOMINAL

NOMINAL

NOMINAL

MIN.

MAX.

1206

3.06

1.60

0.40

1.215

0.63

0.50

0.76

2010

5.08

2.54

0.48

2.25

CHIP SIZE

DIMENSIONS (in millimeter)

1206

3.91

0.50

1.73

2010

5.93

2.67

A

B

D

E

F

Enlarged

termination

Uncoated

ceramic

Bottom view for mounting

G

min.

Z

max.

X

max.