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MIC2199BML 数据表(PDF) 13 Page - Micrel Semiconductor

部件名 MIC2199BML
功能描述  300kHz 4mm 횞 4mm Synchronous Buck Converter
PDF  14 Pages
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制造商  MICREL [Micrel Semiconductor]
网页  http://www.micrel.com
标志 MICREL - Micrel Semiconductor

MIC2199BML 数据表(HTML) 13 Page - Micrel Semiconductor

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Micrel, Inc.
MIC2199.
January 2010
13
M9999-011310
Decoupling Capacitor Selection
The 4.7µF decoupling capacitor is used to minimize noise on
the VDD pin. The placement of this capacitor is critical to the
proper operation of the IC. It must be placed right next to the
pins and routed with a wide trace. The capacitor should be a
good quality tantalum. An additional 1µF ceramic capacitor
maybenecessarywhendrivinglargeMOSFETswithhigh
gate capacitance. Incorrect placement of the VDD decoupling
capacitor will cause jitter or oscillations in the switching wave-
form and large variations in the overcurrent limit.
A 0.1µF ceramic capacitor is required to decouple the VIN.
The capacitor should be placed near the IC and connected
directly to between pin 6 (VIN) and pin 9 (GND).
PCB Layout and Checklist
PCBlayoutiscriticaltoachievereliable,stableandefficient
performance.AgroundplaneisrequiredtocontrolEMIand
minimize the inductance in power, signal and return paths.
The following guidelines should be followed to insure proper
operation of the circuit.
• Signalandpowergroundsshouldbekeptseparate
and connected at only one location. Large currents
orhighdi/dtsignalsthatoccurwhentheMOSFETs
turn on and off must be kept away from the small
signal connections.
• Theconnectionbetweenthecurrent-senseresis-
tor and the MIC2199 current-sense inputs (pin 4
and 5) should have separate traces, through a
10Ωresistoroneachpin.Thetracesshouldbe
routed as closely as possible to each other and
their length should be minimized. Avoid running
the traces under the inductor and other switching
components.The10Ωresistorshouldbeplaced
close as possible to pins 4 and 5 on the MIC2199
and a 1nF to 0.1µF capacitor placed between pins
4 and 5 will help attenuate switching noise on the
current sense traces. This capacitor should be
placed close to pins 4 and 5.
• Whenthehigh-sideMOSFETisswitchedon,the
criticalflowofcurrentisfromtheinputcapacitor
through the MOSFET, inductor, sense resistor,
output capacitor, and back to the input capacitor.
These paths must be made with short, wide pieces
of trace. It is good practice to locate the ground
terminals of the input and output capacitors close
to each.
• Whenthelow-sideMOSFETisswitchedon,cur-
rent flows through the inductor, sense resistor,
outputcapacitor,andMOSFET.Thesourceofthe
low-sideMOSFETshouldbelocatedclosetothe
output capacitor.
• Thefreewheelingdiode,D1inFigure2,conducts
currentduringthedeadtime,whenbothMOSFETs
are off. The anode of the diode should be located
close to the output capacitor ground terminal and
the cathode should be located close to the input
side of the inductor.
• The4.7µFcapacitor,whichconnectstotheVDD
terminal (pin 7) must be located right at the IC. The
VDDterminalisverynoisesensitiveandplacement
of this capacitor is very critical. Connections must
be made with wide trace. The capacitor may be
located on the bottom layer of the board and con-
nected to the IC with multiple vias.
• TheVIN bypass capacitor should be located close
to the IC and connected between pins 6 and 9.
Connections should be made with a ground and
power plane or with short, wide trace.



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