www.vishay.com

Document Number: 60030

80

Revision: 12-Jan-11

PLT

Vishay Thin Film

Precision Low TCR Thin Film Resistor,

Surface Mount Chip, ± 5 ppm/°C TCR, 0.01 % Tolerance

Note

Note

DIMENSIONS in inches

CASE SIZE

TERM

L

W

T

D

E

0603

B

0.064 ± 0.006

0.032 ± 0.005

0.020 max.

0.012 ± 0.005

0.015 ± 0.005

B

0.080 ± 0.006

0.050 ± 0.005

0.015 to 0.033

0.016 ± 0.008

0.015 ± 0.005

1206

B

0.126 ± 0.008

0.063 ± 0.005

0.015 to 0.033

0.020 + 0.005/- 0.010

0.020 + 0.005/- 0.010

D

W

L

T

E

ENVIRONMENTAL TESTS - TYPICAL

ENVIRONMENTAL TEST

10 k

 R ±

(%)

100 k

 R ±

(%)

Thermal Shock

0.02

0.02

Short Time Overload

0.01

0.01

Low Temperature Operation

0.01

0.01

Resistance to Solder Heat

0.01

0.01

Moisture Resistance

0.02

0.02

High Temperature Exposure

0.02

0.02

Load Life (10 000 h, + 70 °C)

0.04

0.04

TCR

± 5 ppm/°C

± 5 ppm/°C

DERATING CURVE

Ambient Temperature °C

0

70

125

150

0

20

40

60

80

100

GLOBAL PART NUMBER INFORMATION

GLOBAL

MODEL

CASE

SIZE

TCR

CHARACTERISTIC

RESISTANCE

TOLERANCE

TERMINATION

PACKAGING

PLT

0603

0805

1206

Z = ± 5 ppm/°C

The first 3 digits are

significant figures and

the last digit specifies

the number of zeros to

follow. “R” designates

the decimal point.

Example:

1001 = 1 k



2500 = 250



Special values with more

than 4 significant figures,

use a R for value below

1 k

 and a K for values

greater than 1 k

 to

signify a decimal point.

982R6 = 982.6



532R41 = 532.41



L = ± 0.01 %

Q = ± 0.02 %

A = ± 0.05 %

B = ± 0.1 %

B = Wraparound Sn/Pb

solder w/Ni barrier

(63 % Sn/37 % Pb w/

nickel barrier)

S = Wraparound

lead (Pb)-free solder

96.5 % Sn/3.0 % Ag/

0.5 % Cu

RoHS compliant - e1

WS = WAFFLE PACK

TAPE AND REEL

T0 = 100 min., 100 mult

T3 = 300 min., 300 mult

T5 = 500 min., 500 mult

TF = Full reel

TS = 100 min., 1 mult

0

3

Z1

0

1

Q

0

0

BT

1

T

PL

6