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PHP 数据表(PDF) 2 Page - Vishay Siliconix

部件名 PHP
功能描述  High Power Thin Film Wraparound Chip Resistor
PDF  4 Pages
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制造商  VISHAY [Vishay Siliconix]
网页  http://www.vishay.com
标志 VISHAY - Vishay Siliconix

PHP 数据表(HTML) 2 Page - Vishay Siliconix

  PHP Datasheet HTML 1Page - Vishay Siliconix PHP Datasheet HTML 2Page - Vishay Siliconix PHP Datasheet HTML 3Page - Vishay Siliconix PHP Datasheet HTML 4Page - Vishay Siliconix  
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For technical questions, contact: thinfilm@vishay.com
Document Number: 60076
80
Revision: 24-Feb-11
PHP
Vishay Thin Film
High Power Thin Film Wraparound Chip Resistor
Notes
• Chip surface temperature measured using FLIR A40 thermal
imaging system with an approximate test card surface
temperature of 85 °C.
• Thermal imaging was conducted under ambient conditions
resulting in a steady state test card surface temperature of 85 °C
over the full range of power levels.
• Thermal imaging and load life testing was conducted mounting
one device to 2" x 3" test cards with 2.5 mil copper plating on
both surfaces. Thermal vias on 120 mil centers were utilized for
heat transfer between surfaces of the test card.
Notes
• Chip surface temperature measured using FLIR A40 thermal
imaging system with an approximate test card surface
temperature of 85 °C.
DIMENSIONS in inches
CASE SIZE
LENGTH
WIDTH
W (± 0.005)
THICKNESS
MIN./MAX.
TOP PAD
D (± 0.005)
BOTTOM PAD
E (± 0.005)
1206
0.126 ± 0.008
0.063
0.015/0.033
0.020 + 0.005/- 0.010
0.040
2512
0.259 + 0.009/- 0.015
0.124
0.015/0.033
0.02
0.050
LAND PATTERN DIMENSIONS in inches
STANDARD MATERIAL SPECIFICATIONS
Resistive Element
Nichrome
Substrate Material
Alumina (Al2O3)
Terminations (Tin/Lead)
Tin/lead solder over nickel barrier
Terminations (Lead (Pb)-free)
Tin/silver/copper (Sn96.5Ag3.0Cu0.5) solder over nickel barrier
D
W
T
L
E
PHP Land Pattern for 1206 Case Size
PHP Land Pattern for 2512 Case Size
0.0710
0.0755
0.0220
0.1260
0.0910
0.1090
PHP CHIP TEMP. VS. APPLIED POWER
Chip Surface Temperature (°C)
70
200
0.00
0.50
1.00
1.50
2.00
5.00
2.50
3.00
3.50
4.00
4.50
150
1206 - 100
Ω
1206 - 5 k
Ω
1206 - 10 k
Ω
PHP CHIP TEMP. VS. APPLIED POWER
Case Size
2512
2512
2512
Resistance
Value
Up to 10
Up to 10 k
Up to 30 k
Temperature
Power (W)
70
2.44
1.81
1.87
150
6.82
4.89
5.19
200
9.33
6.63
7.09
Chip Surface Temperature (°C)
70
200
0.00
1.00
2.00
3.00
4.00
10.00
5.00
6.00
7.00
8.00
9.00
150
2512 - 10
Ω
2512 - 10 k
Ω
2512 - 30 k
Ω



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