© 2009 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FSBH0F70A, FSBH0170/A, FSBH0270/A, FSBH0370 • Rev. 1.0.3

15

Physical Dimensions

5.08 MAX

0.33 MIN

2.54

7.62

0.56

0.355

1.65

1.27

3.683

3.20

3.60

3.00

6.67

6.096

9.83

9.00

7.62

9.957

7.87

0.356

0.20

NOTES: UNLESS OTHERWISE SPECIFIED

A) THIS PACKAGE CONFORMS TO

JEDEC MS-001 VARIATION BA

B) ALL DIMENSIONS ARE IN MILLIMETERS.

C) DIMENSIONS ARE EXCLUSIVE OF BURRS,

MOLD FLASH, AND TIE BAR EXTRUSIONS.

D) DIMENSIONS AND TOLERANCES PER

ASME Y14.5M-1994

8.255

7.61

E) DRAWING FILENAME AND REVSION: MKT-N08FREV2.

(0.56)

Figure 35.

8-Pin Dual In-Line Package (DIP)

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify

or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically

the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/.